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1

UV curing effects on mechanical and electrical performances of a PECVD non-porogen porous SiOC:H films (in k [2.2–2.4] range) for 45 nm node and below

L.L. Chapelon, J. Vitiello, J.P. Gonchond, D. Barbier, J. Torres

Journal:

Microelectronic Engineering

Year:

2006

Language:

english

File:

PDF, 1.20 MB

english, 2006

2

Electromigration in ALCu interconnections with W-plug contacts

L. Ferlazzo, G. Reimbold, J. P. Gonchond, M. Heitzmann, O. Demolliens, G. Lormand

Journal:

Quality and Reliability Engineering International

Year:

1993

Language:

english

File:

PDF, 384 KB

english, 1993

3

X-ray metrology for advanced silicon processes

C. Wyon, J.P. Gonchond, D. Delille, A. Michallet, J.C. Royer, L. Kwakman, S. Marthon

Journal:

Applied Surface Science

Year:

2006

Language:

english

File:

PDF, 1011 KB

english, 2006

4

Effect of post-metallization annealing on W/Cr-metallized silicon junctions

J.P. Gonchond, P. Giordano, J.C. Oberlin, M. Paoli, A. Chantre

Journal:

Materials Science and Engineering: B

Year:

1989

Language:

english

File:

PDF, 444 KB

english, 1989

5

In-line monitoring of advanced microelectronic processes using combined X-ray techniques

C. Wyon, D. Delille, J.P. Gonchond, F. Heider, L. Kwakman, S. Marthon, I. Mazor, A. Michallet, D. Muyard, L. Perino-Gallice, J.C. Royer, A. Tokar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 934 KB

english, 2004

6

Observation of submicronic contacts and vias by scanning ion and electron microscopy

R. Pantel, G. Mascarin, J. P. Gonchond, D. Lafond

Journal:

Quality and Reliability Engineering International

Year:

1994

Language:

english

File:

PDF, 732 KB

english, 1994

7

Physical and electrical characterization of a SILO isolation structure

Deroux-Dauhphin, P., Gonchond, J.-P.

Journal:

IEEE Transactions on Electron Devices

Year:

1985

Language:

english

File:

PDF, 1.65 MB

english, 1985

8

X-ray rocking curves for silicon-on-sapphire characterization

Trilhe, J., Borel, J., Gonchond, J. P.

Journal:

Journal of Applied Physics

Year:

1980

Language:

english

File:

PDF, 510 KB

english, 1980

9

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - 3D Multi-Frequency MEMS Electromechanical Resonator Design

Casset, F., Durand, C., Dedieu, S., Carpentier, J.F., Gonchond, J. P., Ancey, P., Robert, P.

Year:

2009

Language:

english

File:

PDF, 8.33 MB

english, 2009

10

Optimization of a self-aligned titanium silicide process for submicron technology

Levy, D., Delpech, P., Paoli, M., Masurel, C., Vernet, M., Brun, N., Jeanne, J.-P., Gonchond, J.-P., Ada-Hanifi, M., Haond, M., D'Ouville, T.T., Mingam, H.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

1990

Language:

english

File:

PDF, 1016 KB

english, 1990

11

Leakage mechanisms of titanium silicided n+/p junctions fabricated using rapid thermal processing

Ada-Hanifi, M., Chantre, A., Levy, D., Gonchond, J. P., Delpech, Ph., Nouailhat, A.

Journal:

Applied Physics Letters

Year:

1991

Language:

english

File:

PDF, 621 KB

english, 1991

12

Leakage mechanism for tungsten/chromium metallized silicon p/n junctions

P. Giordano, J. P. Gonchond, J. C. Oberlin, P. Normandon, R. Basset, A. Chantre

Year:

1989

Language:

english

File:

PDF, 624 KB

english, 1989

13

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Thin films interfacial adhesion characterization by Cross-Sectional Nanoindentation: Application to pad structures

Gallois-Garreignot, S., Chave, F., Gonchond, J.P., Gautheron, B., Fiori, V., Nelias, D.

Year:

2009

Language:

english

File:

PDF, 2.22 MB

english, 2009

14

[IEEE IEEE SOS/SOI Technology Conference - Stateline, NV, USA (3-5 Oct. 1989)] IEEE SOS/SOI Technology Conference - Gate oxide breakdown behaviour in a mesa SOI CMOS process

Haond, M., Le Neel, O., Mascarin, G., Gonchond, J.P.

Year:

1989

Language:

english

File:

PDF, 120 KB

english, 1989

15

Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient

Caubet, Pierre, Blomberg, Tom, Benaboud, Rym, Wyon, Christophe, Blanquet, Elisabeth, Gonchond, Jean-Pierre, Juhel, Marc, Bouvet, Philippe, Gros-Jean, Mickaël, Michailos, Jean, Richard, Claire, Itepra

Journal:

Journal of The Electrochemical Society

Year:

2008

Language:

english

File:

PDF, 922 KB

english, 2008

16

[AIP CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY 2005 - Richardson, Texas (USA) (15-18 March 2005)] AIP Conference Proceedings - Combined XRR and RS Measurements of Nickel Silicide Films

Gonchond, J.-P.

Year:

2005

Language:

english

File:

PDF, 513 KB

english, 2005

17

[AIP CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2007 International Conference on Frontiers of Characterization and Metrology - Gaithersburg, MD (27-29 March 2007)] AIP Conference Proceedings - Ultra Low-κ Metrology Using X-Ray Reflectivity And Small-Angle X-Ray Scattering Techniques

Plantier, L., Gonchond, J.-P., Pernot, F., Peled, A., Wyon, C., Royer, J.-C., Yokhin, B., Seiler, David G., Diebold, Alain C., McDonald, Robert, Garner, C. Michael, Herr, Dan, Khosla, Rajinder P., Sec

Year:

2007

Language:

english

File:

PDF, 1.24 MB

english, 2007

18

Study of the Crystalline to Amorphous Silicon Boundary Following Laser Induced Solid Phase Epitaxy.

Gonchond, J. P., Rozgonyi, G. A., Bois, D.

Journal:

MRS Proceedings

Year:

1981

Language:

english

File:

PDF, 2.43 MB

english, 1981

19

[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - State-of-the-Art Characterization for 65 nm CMOS Processes and Beyond

Hopstaken, Marco, Juhel, Marc, Gonchond, Jean-Pierre, Kwakman, Laurens, Wyon, Christophe

Year:

2006

Language:

english

File:

PDF, 580 KB

english, 2006

20

Properties of TaN Thin Films Produced Using PVD Linear Dynamic Deposition Technique

Kozlowska, M., Oechsner, R., Pfeffer, M., Bauer, A. J., Meissner, E., Pfitzner, L., Ryssel, H., Maass, W., Langer, J., Ocker, B., Schmidbauer, S., Gonchond, J.-P.

Journal:

e-Journal of Surface Science and Nanotechnology

Year:

2009

File:

PDF, 572 KB

2009